- Manufacturer：
-
- BOYD (1)
- CUI Devices (4)
- Ohmite (1)
- Trenz Electronic (2)
- Length：
-
- Material：
-
- Shape：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
24 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
6,839
In-stock
|
View details Get Quote | ||
|
Trenz Electronic | HEAT SPREADER FO... |
1-3 days |
7,327
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,883
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,650
In-stock
|
View details Get Quote |
