- Manufacturer：
-
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
2,271
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
171
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1-3 days |
1,377
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
335
In-stock
|
View details Get Quote |
