Heat Sinks - IFUSON

Attachment Method：

Package Cooled：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Forced Air Flow：

Thermal Resistance @ Natural：

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2 Records

Image	Part	Manufacturer	Description	Factory Lead Time		Stock	Action
	V2269E1	ASSMANN WSW Components	CPU HEATSINK, CRO...	1-3 days	RFQ	2,271 In-stock	View details Get Quote
	HSB07-202009	CUI Devices	HEAT SINK, BGA, 20 ...	1-3 days	RFQ	1,377 In-stock	View details Get Quote

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