- Manufacturer:
-
- BOYD (1)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status:
-
- Length:
-
- Material:
-
- Width:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-220 15X... |
1-3 days |
32,892
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK TO-220 19X... |
1-3 days |
12,152
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,521
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,903
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ST... |
1-3 days |
817
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1-3 days |
548
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 9.... |
1-3 days |
8,480
In-stock
|
View details Get Quote |
