- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Length：
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- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-220 15X... |
1-3 days |
32,892
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220 19X... |
1-3 days |
12,152
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1-3 days |
400
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,521
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,903
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ST... |
1-3 days |
817
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1-3 days |
548
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X9.5M... |
1-3 days |
7,432
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,379
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1-3 days |
8,480
In-stock
|
View details Get Quote |
