- Manufacturer:
-
- CUI Devices (1)
- Malico (1)
- Ohmite (1)
- Wakefield Thermal (21)
- Material:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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28 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 31X15MM D... |
1-3 days |
12
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X23MM D... |
1-3 days |
9,722
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X15MM S... |
1-3 days |
7,335
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X12MM D... |
1-3 days |
5,623
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X15MM F... |
1-3 days |
6,471
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X21MM F... |
1-3 days |
9,192
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X28MM F... |
1-3 days |
4
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 31X28MM D... |
1-3 days |
2
In-stock
|
View details Get Quote |
