- Manufacturer：
-
- CUI Devices (1)
- Malico (1)
- Ohmite (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,885
In-stock
|
View details Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1-3 days |
74
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 31X31X... |
1-3 days |
173
In-stock
|
View details Get Quote |
