- Manufacturer：
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- BOYD (2)
- CUI Devices (1)
- Length：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
154
In-stock
|
View details Get Quote | ||
|
|
BOYD | MAX CLIP HEATSIN... |
1-3 days |
207
In-stock
|
View details Get Quote | ||
|
|
BOYD | MAX CLIP HEATSIN... |
1-3 days |
980
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1-3 days |
146
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
77
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
6,471
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
7,259
In-stock
|
View details Get Quote |
