Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
HSE08-505028 CUI Devices
HEAT SINK, EXTRUS...
1-3 days
RFQ
1,111
In-stock
View details Get Quote
SAR175ASX50MM Sarnikon
EXTRUDED HEATSIN...
1-3 days
RFQ
50
In-stock
View details Get Quote
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