- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
5,245
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,972
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DU... |
1-3 days |
2,272
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,649
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1-3 days |
8,246
In-stock
|
View details Get Quote |
