- Manufacturer：
-
- BOYD (2)
- Comair Rotron (2)
- CTS Corporation (1)
- CUI Devices (1)
- Product Status：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
5,245
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 (DU... |
1-3 days |
703
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK BLK ALU... |
1-3 days |
1,736
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 SM... |
1-3 days |
1,933
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 6.5W... |
1-3 days |
5,783
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,649
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1-3 days |
8,246
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 36... |
1-3 days |
9,214
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK DUAL HO... |
1-3 days |
9,501
In-stock
|
View details Get Quote |
