- Manufacturer：
-
- BOYD (3)
- Comair Rotron (2)
- CUI Devices (1)
- Product Status：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1-3 days |
1,721
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 BL... |
1-3 days |
2,490
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 SM... |
1-3 days |
2,052
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 TO... |
1-3 days |
31,128
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 EX... |
1-3 days |
23,710
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220 17.7... |
1-3 days |
449
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 17... |
1-3 days |
9,663
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 17... |
1-3 days |
5,485
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.9W... |
1-3 days |
9,850
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,320
In-stock
|
View details Get Quote |
