Heat Sinks - IFUSON

Material：

Attachment Method：

Fin Height：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Natural：

Filter：

4 Records

Part	Manufacturer	Description	Factory Lead Time		Stock	Action
HSB18-232310	CUI Devices	HEAT SINK, BGA, 23 ...	1-3 days	RFQ	5,367 In-stock	View details Get Quote
960-23-12-F-AB-0	Wakefield Thermal	HEATSINK 23X12MM F...	1-3 days	RFQ	8,739 In-stock	View details Get Quote
960-23-12-D-AB-0	Wakefield Thermal	HEATSINK 23X12MM D...	1-3 days	RFQ	9,570 In-stock	View details Get Quote
960-23-12-S-AB-0	Wakefield Thermal	HEATSINK 23X12MM S...	1-3 days	RFQ	6,911 In-stock	View details Get Quote

1 / 1 Page, 4 Records