- Manufacturer：
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- Cooling Source (2)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1-3 days |
5,367
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
1,713
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 23X23X10MM, T412 |
1-3 days |
208
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 23X23X10MM, T411 |
1-3 days |
8,821
In-stock
|
View details Get Quote |
