- Manufacturer：
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- Cooling Source (1)
- CUI Devices (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
135
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1-3 days |
3,562
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
2,252
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1-3 days |
6,320
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 17X17 95MM WITH INTE... |
1-3 days |
6,954
In-stock
|
View details Get Quote |
