- Manufacturer：
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- BOYD (3)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA 35X35... |
1-3 days |
7,841
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/O ... |
1-3 days |
918
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1-3 days |
976
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
1,753
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
1,494
In-stock
|
View details Get Quote |
