- Manufacturer：
-
- CUI Devices (3)
- Ohmite (2)
- Material：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,998
In-stock
|
View details Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
8,117
In-stock
|
View details Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
3
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,521
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,865
In-stock
|
View details Get Quote |
