- Manufacturer：
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- BOYD (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | UNIVERSAL TO HEA... |
1-3 days |
345
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-3 TRA... |
1-3 days |
835
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR TO66 |
1-3 days |
6,085
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO66 |
1-3 days |
9,303
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO66 |
1-3 days |
5,672
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,111
In-stock
|
View details Get Quote |
