- Manufacturer：
-
- CUI Devices (3)
- Ohmite (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK TO-218,TO... |
1-3 days |
1,825
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,052
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,182
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,452
In-stock
|
View details Get Quote |
