- Manufacturer：
-
- BOYD (2)
- CUI Devices (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,741
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,648
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,133
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,377
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3 76.2X25.4X0.21MM |
1-3 days |
8,639
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3 101.6X25.4X0.21MM |
1-3 days |
5,416
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 101.6X25.4X... |
1-3 days |
8,765
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 76.2X25.4X0... |
1-3 days |
6,528
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 76.2X25.4X0... |
1-3 days |
6,417
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 101.6X25.4X... |
1-3 days |
8,485
In-stock
|
View details Get Quote |
