- Manufacturer：
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- CUI Devices (4)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
398
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
1,169
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,281
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,184
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
9,279
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,409
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,512
In-stock
|
View details Get Quote |
