- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Product Status：
-
- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
4,992
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,401
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 76.2X19.1X0... |
1-3 days |
9,393
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 76.2X19.1X0... |
1-3 days |
9,779
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3 76.2X19.1X0.21MM |
1-3 days |
6,398
In-stock
|
View details Get Quote |
