- Manufacturer：
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- BOYD (2)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
12,917
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK 1.75" HIG... |
1-3 days |
1,790
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
4,992
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK COMPACT |
1-3 days |
8,969
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
1-3 days |
7,314
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
1-3 days |
7,003
In-stock
|
View details Get Quote |
