- Manufacturer：
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- BOYD (5)
- CUI Devices (1)
- Length：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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12 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 2.5W... |
1-3 days |
12,990
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
12,917
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 LO... |
1-3 days |
2,432
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK 1.75" HIG... |
1-3 days |
1,790
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220 19.0... |
1-3 days |
9,452
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 LO... |
1-3 days |
23,142
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
4,992
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,645
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
1-3 days |
8,969
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
1-3 days |
7,314
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,401
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK COMPACT |
1-3 days |
7,003
In-stock
|
View details Get Quote |
