- Manufacturer：
-
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1-3 days |
8,220
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK |
1-3 days |
6,148
In-stock
|
View details Get Quote |
