- Manufacturer：
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- BOYD (1)
- CTS Corporation (1)
- Type：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1-3 days |
402
In-stock
|
View details Get Quote | ||
|
CTS Corporation | HEATSINK CPU W/AD... |
1-3 days |
7,416
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,007
In-stock
|
View details Get Quote |
