- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1-3 days |
976
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,366
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1-3 days |
6,543
In-stock
|
View details Get Quote |
