- Manufacturer：
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- BOYD (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 35X35X23MM... |
1-3 days |
146
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
335
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 35X35X23MM... |
1-3 days |
121
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,123
In-stock
|
View details Get Quote |
