- Manufacturer：
-
- BOYD (4)
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,870
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
43
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
17
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,717
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,342
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,516
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
1-3 days |
8,072
In-stock
|
View details Get Quote |
