- Product Status:
-
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
11 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
2,400
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1-3 days |
7,492
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1-3 days |
5,235
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1-3 days |
7,980
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1-3 days |
6,004
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1-3 days |
6,730
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
8,515
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
9,779
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,959
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
6,568
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
5,188
In-stock
|
View details Get Quote |
