- Manufacturer:
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- CUI Devices (1)
- Material:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1-3 days |
92
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,506
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 7 FINS, 2.000 OD HS W... |
1-3 days |
7,639
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 7 FINS,2.000 OD HS W/... |
1-3 days |
9,204
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 7 FINS,2.000 OD HS W/... |
1-3 days |
7,572
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 7 FINS, 2.000 OD HS W... |
1-3 days |
6,605
In-stock
|
View details Get Quote |
