- Manufacturer:
-
- Cooling Source (1)
- CUI Devices (1)
- Diameter:
-
- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1-3 days |
2,970
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1-3 days |
7,750
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W... |
1-3 days |
5,986
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 2 FINS, 2.00 OD HS W/... |
1-3 days |
9,175
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W... |
1-3 days |
9,748
In-stock
|
View details Get Quote | ||
|
Cooling Source | 25X25 X20MM |
1-3 days |
9,868
In-stock
|
View details Get Quote |
