- Manufacturer：
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- BOYD (1)
- Type：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
5,533
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17... |
1-3 days |
966
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17... |
1-3 days |
576
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
100
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 17X17X19.5M... |
1-3 days |
9,819
In-stock
|
View details Get Quote |
