- Manufacturer：
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- BOYD (2)
- Type：
-
- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-3 H31.7... |
1-3 days |
1,369
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
7,506
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
8,944
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
6,391
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
8,172
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
9,262
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,980
In-stock
|
View details Get Quote |
