- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,741
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X12MM S... |
1-3 days |
358
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
124
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1-3 days |
252
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1-3 days |
293
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1-3 days |
29
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X7.5M... |
1-3 days |
6,220
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1-3 days |
18
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X12MM F... |
1-3 days |
6,637
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 21X12MM D... |
1-3 days |
6,302
In-stock
|
View details Get Quote |
