- Manufacturer:
-
- BOYD (1)
- Product Status:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1-3 days |
1,138
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO-220 10W... |
1-3 days |
9,932
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
144
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
24,635
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
8,995
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
6,057
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1-3 days |
6,267
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1-3 days |
9,717
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
6,394
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
9,185
In-stock
|
View details Get Quote |
