- Manufacturer:
-
- BOYD (2)
- Comair Rotron (1)
- Product Status:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
-
- Thermal Resistance @ Natural:
-
12 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
3,585
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
2,800
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,377
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK TO-220 BL... |
1-3 days |
2,490
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
316
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
6,562
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
8,048
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 17... |
1-3 days |
5,485
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
9,566
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,604
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,648
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,320
In-stock
|
View details Get Quote |
