- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1-3 days |
817
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1-3 days |
259
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X15MM S... |
1-3 days |
45
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X24.5M... |
1-3 days |
8,561
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X15MM D... |
1-3 days |
20
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X15MM F... |
1-3 days |
9,872
In-stock
|
View details Get Quote |
