- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Type：
-
- Material：
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- Width：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 PW... |
1-3 days |
7,871
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 EX... |
1-3 days |
23,710
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,613
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DU... |
1-3 days |
5,971
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 36... |
1-3 days |
5,896
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK |
1-3 days |
6,116
In-stock
|
View details Get Quote |
