- Manufacturer：
-
- CUI Devices (1)
- iWave Systems (2)
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1-3 days |
2,963
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
6
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
43
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
17
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
43
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
8
In-stock
|
View details Get Quote | ||
|
|
iWave Systems | ZU+ MPSOC SOM MOD... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
|
iWave Systems | ARRIA10 SOC SOM HE... |
1-3 days |
10
In-stock
|
View details Get Quote |
