- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
-
3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | PIN FIN HEATSINK |
1-3 days |
163
In-stock
|
View details Get Quote | ||
|
|
Ohmite | PIN FIN HEATSINK |
1-3 days |
436
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,477
In-stock
|
View details Get Quote |
