- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4W ... |
1-3 days |
2,988
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR TO21... |
1-3 days |
5,284
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1-3 days |
7,091
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1-3 days |
7,331
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1-3 days |
5,967
In-stock
|
View details Get Quote |
