- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 AL... |
1-3 days |
800
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK BLK ANO... |
1-3 days |
3,805
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,931
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1-3 days |
246
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1-3 days |
103
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | COPPER HEATSINK ... |
1-3 days |
8
In-stock
|
View details Get Quote | ||
|
|
BOYD | COPPER HEATSINK ... |
1-3 days |
7,887
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | ALUMINUM HEATSIN... |
1-3 days |
7,193
In-stock
|
View details Get Quote |
