Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Factory Lead Time Stock Action
ATS-EXL116-300-R0 Advanced Thermal Solutions, Inc.
EXTRUSION 300X51.6X...
1-3 days
RFQ
47
In-stock
View details Get Quote
ATS-EXL116-1220-R0 Advanced Thermal Solutions, Inc.
PCIE EXTRUSION P...
1-3 days
RFQ
11
In-stock
View details Get Quote
HSS-B20-0508H-01 CUI Devices
HEATSINK TO-220 7.4W...
1-3 days
RFQ
7,596
In-stock
View details Get Quote
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