- Manufacturer：
-
- BOYD (1)
- CUI Devices (2)
- Length：
-
- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
289
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1-3 days |
1,072
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
5,664
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1-3 days |
48,823
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
1-3 days |
2,325
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK ASSY FO... |
1-3 days |
9,922
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1-3 days |
7,379
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ASSY FO... |
1-3 days |
7,699
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATINK ASSY FOR... |
1-3 days |
6,280
In-stock
|
View details Get Quote |
