- Manufacturer:
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- CUI Devices (1)
- Type:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
117
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
113
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
803
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | MAXIFLOW 18.25X18.25X... |
1-3 days |
99
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
874
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X9.5M... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X9.5M... |
1-3 days |
6,732
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
8,822
In-stock
|
View details Get Quote |
