- Manufacturer:
-
- BOYD (1)
- CUI Devices (2)
- Sarnikon (5)
- Length:
-
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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11 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
294
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
634
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,111
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,000
In-stock
|
View details Get Quote | ||
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
9,828
In-stock
|
View details Get Quote | ||
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
5,356
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
6,204
In-stock
|
View details Get Quote | ||
|
BOYD | 78015 4.6 |
1-3 days |
354
In-stock
|
View details Get Quote |
