Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
V2022B ASSMANN WSW Components
HEATSINK CPU XCU...
1-3 days
RFQ
491
In-stock
View details Get Quote
HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 ...
1-3 days
RFQ
9,183
In-stock
View details Get Quote
1 / 1 Page, 2 Records