Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
V2023B ASSMANN WSW Components
HEATSINK CPU XCU...
1-3 days
RFQ
1,112
In-stock
View details Get Quote
HSB10-232306 CUI Devices
HEAT SINK, BGA, 23 ...
1-3 days
RFQ
1,321
In-stock
View details Get Quote
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