- Manufacturer：
-
- BOYD (4)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
1,766
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TI... |
1-3 days |
12,459
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TI... |
1-3 days |
6,000
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
1,747
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,736
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK |
1-3 days |
6,680
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 13... |
1-3 days |
8,320
In-stock
|
View details Get Quote |
